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  • Job reference: RMS0163860

QFN Die Attach Engineer

  • Sector: Commercial
  • Location: Malaysia
  • Job type: Permanent
  • Date posted: 04/03/2016
This vacancy has now been filled.

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The Company:
A semiconductor industry company that is driving energy efficient innovations, empowering customers
to reduce global energy use. The company is a leading supplier of semiconductor based
solutions, offering a comprehensive portfolio of energy efficient power and signal
management, logic, standard and custom devices.

The Role:
-Experience in die attach machine and process especially epoxy die attach method.
-Responsible for yield and scrap performance.
-Capable to introduce new product development.
-Run improvement evaluation.
-Responsible for disposition of abnormal lot of die attach area

Essential Skills / Qualifications:
Degree in Engineering
1 year of experience in die attach method, epoxy

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